We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Flip Chip Bonder.
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Flip Chip Bonder - Company Ranking(10 companies in total)

Last Updated: Aggregation Period:Sep 17, 2025〜Oct 14, 2025
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μ... **Features** - Implementation accuracy of 0.3μm@3sigma - Complete automation of various implementation processes - Manual operation routines...
【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine... 【Features】 ○ Compatible chip size: 0.03mm - 20mm ○ Compatible substrate size: up to 150mm ○ Overlay display of die, chip, and mounting subst...
【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View R... 【Features】 ○ Implementation with sub-micron precision within a 300mm substrate size area ○ Achieves maximum optical resolution at all magn...
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  1. Featured Products
    High-precision flip chip bonder 'femto2'High-precision flip chip bonder 'femto2'
    overview
    【Main Specifications】 ○ Mounting Accuracy: ±0.3μm @ 3Sigma ○ Optical Field of View: 3.8mm x 2.7mm ○ Optical Field of View Resolution: 1μ...
    Application/Performance example
    **Features** - Implementation accuracy of 0.3μm@3sigma - Complete automation of various implementation processes - Manual operation routines...
    High-precision flip chip bonder: lambda2High-precision flip chip bonder: lambda2
    overview
    【Main Specifications】 ○ Mounting Accuracy: 0.5μm ○ Optical Field of View Range: 0.54mm×0.43mm (minimum), 6.6mm×5.28mm (maximum) ○ θ Fine...
    Application/Performance example
    【Features】 ○ Compatible chip size: 0.03mm - 20mm ○ Compatible substrate size: up to 150mm ○ Overlay display of die, chip, and mounting subst...
    High-precision, high-function flip chip bonder: sigmaHigh-precision, high-function flip chip bonder: sigma
    overview
    【Main Specifications】 ○ Mounting Accuracy: ±0.5μm ○ Optical Field of View Range: 3.8mm (expanded 83mm) x 2.7mm ○ Optical Field of View R...
    Application/Performance example
    【Features】 ○ Implementation with sub-micron precision within a 300mm substrate size area ○ Achieves maximum optical resolution at all magn...