Flip Chip Bonder - Company Ranking(10 companies in total)
Last Updated： Aggregation Period:Dec 17, 2025〜Jan 13, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ... | MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, MTP etc. | ||
| Described in the catalog materials. | Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please... | ||
| Described in the catalog materials. | Applications: Semiconductor advanced packaging, MEMS, Automotive Sensors, RFID, LED, Optoelectronic | ||
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- Featured Products
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ASMPT's ultra-high precision flip chip bonder 'NANO Pro'
- overview
- ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ...
- Application/Performance example
- MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, MTP etc.
ASMPT's ultra-high precision flip chip bonder 'NANO'
- overview
- Described in the catalog materials.
- Application/Performance example
- Usage: MicroLED, Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP Examples of achievements: Please...
ASMPT manufactured flip chip bonder - Novaplus
- overview
- Described in the catalog materials.
- Application/Performance example
- Applications: Semiconductor advanced packaging, MEMS, Automotive Sensors, RFID, LED, Optoelectronic
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